New Developments in PCB Laminates

Published:

July 19, 2012

Author:

Dean Hattula, John Coonrod

Abstract:

First published in the 2012 IPC APEX EXPO technical conference proceedings. With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards high...

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Company Information:

Rogers' high performance laminates and bondplies are engineered to meet stringent customer requirements for 5G wireless communication, wired infrastructure, automotive radar sensors, aerospace, satellites and more.

Chandler, Arizona, USA

Manufacturer

  • Phone 480-961-1382

See Company Website »

Company Postings:

(4) products in the catalog

(5) technical library articles

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