An Investigation of Whisker Growth on Tin Coated Wire and Braid
Published: |
August 2, 2012 |
Author: |
Dave Hillman, Tim Pearson, Thomas Lesniewski |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. Pure tin is a common finish for copper hook up wire, coaxial cable, ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports o... |
|
Company Information:
More articles from Rockwell Collins »
- Jan 05, 2015 - The Last Will And Testament of the BGA Void
- Apr 29, 2008 - The Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity.
- See all SMT / PCB technical articles from Rockwell Collins »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
An Investigation of Whisker Growth on Tin Coated Wire and Braid article has been viewed 645 times