Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

Published:

September 13, 2012

Author:

Ward Gatza; Agilent Technologies, Inc., Tom Evans; Thomas C. Evans Consulting

Abstract:

First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor...

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September 18, 2012

Hi Ward ... Neat study. Too bad the sample size wasn't larger. So, what are your plans to move forward with this project and develop a better understanding of the effect on the reliability of various reflow technologies?

September 18, 2012

What is your sense, without hard data support, of the effect of various reflow technologies on the reliability of circuit boards?

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