Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints
Published: |
September 13, 2012 |
Author: |
Ward Gatza; Agilent Technologies, Inc., Tom Evans; Thomas C. Evans Consulting |
Abstract: |
First published in the 2012 IPC APEX EXPO technical conference proceedings. Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor... |
|
|
|
|
|
|
You must be a More articles from Agilent Technologies, Inc. »
- Dec 17, 2015 - Good Product Quality Comes From Good Design for Test Strategies
- Aug 13, 2015 - Pad Cratering Susceptibility Testing with Acoustic Emission
- Aug 29, 2013 - Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging
- Feb 14, 2013 - Boundary Scan Advanced Diagnostic Methods
- Oct 18, 2012 - The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
- See all SMT / PCB technical articles from Agilent Technologies, Inc. »
More SMT / PCB assembly technical articles »
- Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
- Dec 02, 2020 - SMT007-MIRTEC Intelligent Factory Automation Article-November 2020 | MIRTEC Corp
- Nov 09, 2020 - Ball Grid Array (BGA) Voiding Affecting Functionality | ACI Technologies, Inc.
- Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
- Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
- Browse Technical Library »
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints article has been viewed 383 times
davef
September 18, 2012
Hi Ward ... Neat study. Too bad the sample size wasn't larger. So, what are your plans to move forward with this project and develop a better understanding of the effect on the reliability of various reflow technologies?