Identification and Prevention of "Black Pad"

Published:

January 17, 2013

Author:

Kong Hui Lee

Abstract:

The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring....

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Company Information:

Jabil Circuit, Inc.

An electronic product solutions company providing comprehensive electronics design, manufacturing and product management services.

St. Petersburg, Florida, USA

Design, Service Provider

  • Phone (727) 577-9749

Jabil Circuit, Inc. website

Company Postings:

(3) technical library articles

(5) news releases

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