Vapor Phase Technology and its Application

Published:

March 27, 2013

Author:

Allen Duck

Abstract:

Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase....

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Company Information:

A-Tek Systems Group LLC

Distributor of the highest quality SMT assembly equipment. Our 45 years of combined experience and commitment to excellence have earned us the reputation as the premier distributor in the Americas.

Longmont, Colorado, USA

Cleaning, Distributor, Drilling / Routing, Selective Soldering, Soldering

  • Phone 970 532 5100
  • Fax 9704439233

A-Tek Systems Group LLC website

Company Postings:

(102) products in the catalog

(1) technical library article

(8) news releases

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