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Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging

Published:

August 29, 2013

Author:

Mike Powers, Jianbiao Pan, Julie Silk, Patrick Hyland

Abstract:

Au over Ni on Cu is a widely used printed circuit board (PCB) surface finish, under bump metallization (UBM), and component lead metallization. It is generally accepted that less than 3 wt.% Au in Sn-Pb solder joints inhibits formation of detrimental intermetallic compounds (IMC). However, the critical limit for Au content in Pb-free solder joints is not well established. Three surface-mount package platforms, one with a matte Sn surface finish and the others with Ni/Au finish, were soldered to Ni/Au-finished PCB using Sn-3.0Ag 0.5Cu (SAC305) solder, in a realistic manufacturing setting. The assembled boards were divided into three groups: one without any thermal treatment, one subjected to isothermal aging at 125°C for 30 days, and the third group aged at 125°C for 56 days... ...

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Company Information:

Agilent Technologies, Inc.

World's premier measurement company, providing the critical tools and technologies that sense, measure, and interpret the physical and biological world.

Loveland, Colorado, USA

Manufacturer of Assembly Equipment

  • Phone 1 (800) 829-4444

Agilent Technologies, Inc. website

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