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Reliability Performance of Very Thin Printed Circuit Boards with regard to Different any Layer Manufacturing Technologies.

Published:

September 19, 2013

Author:

Gerhard Schmid, Martin Fischeneder, Gerhard Stoiber

Abstract:

The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches, which can be used for very thin any-layer build-ups. The technological approaches are compared on reliability level – the any-layer copper filled micro-via technology which is to be considered as state of the art technology for high end phones and the ALIVH-C/G technology that is well established in Japan. A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation......

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Company Information:

AT&S is currently Europe’s largest printed circuit board manufacturer and one of the market leaders in high-end printed circuit board technology.

Leoben, Austria

Manufacturer

  • Phone +43 3842 200-0

See Company Website »

Company Postings:

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