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Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications

Published:

November 27, 2013

Author:

Olivier Vendier, Jean-Louis Cazaux, Jean-Luc Lortal; Thales Alenia Space.

Abstract:

The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing, with a significantly growing number of amplitude / phase control points (number of beams * numbers of radiating elements). As a consequence, the RF component’s package topology is evolving (larger number of I/Os, interconnections densification ...) which directly affect the routing and architecture of the multilayer boards they are mounted on. It then becomes necessary to improve the density of these boards (...) This paper will present the work performed to achieve LCP-based high density multilayer structures, describing the different electrical and technological breadboards manufactured and tested and presenting the results obtained....

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Company Information:

A French multinational company acting in areas such as defense, aerospace, airlines security and safety, information technology, and transportation.

Neuilly-sur-Seine, France

Other

  • Phone +33 1 57 77 80 00

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Company Postings:

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