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Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect.

Published:

March 6, 2014

Author:

Jasbir Bath, Roberto Garcia - Christopher Associates Inc. Noriyoshi Uchida, Hajime Takahashi, Gordon Clark, Manabu Itoh - Koki Solder

Abstract:

Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP component solder spheres with the molten solder paste during reflow. The issue has occurred across a broad segment of industries including consumer, telecom and military. There are many reasons for this issue such as warpage issues of the component or board, ball co-planarity issues for BGA/CSP components and non-wetting of the component based on contamination or excessive oxidation of the component coating. The issue has been found to occur not only on lead-free soldered assemblies where the increased soldering temperatures may give rise to increase component/board warpage but also on tin-lead soldered assemblies....

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Company Information:

Christopher Associates Inc.

A pioneering supplier and distributor to the electronics and chemical processing industries.

Santa Ana, California, USA

Inspection

  • Phone 714-979-7500
  • Fax 714-557-6904

Christopher Associates Inc. website

Company Postings:

(3) products in the catalog

(2) technical library articles

(103) news releases

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