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Effect of Cu–Sn intermetallic Compound Reactions on the Kirkendall Void Growth Characteristics in Cu/Sn/Cu Microbumps

Published:

July 2, 2014

Author:

Jong-Myeong Park, Seung-Hyun Kim, Young-Bae Park - Andong National University, Myeong-Hyeok Jeong - NEPES Corporation.

Abstract:

Growth behaviors of intermetallic compounds (IMCs) and Kirkendall voids in Cu/Sn/Cu microbump were systematically investigated by an in-situ scanning electron microscope observation. Cu–Sn IMC total thickness increased linearly with the square root of the annealing time for 600 h at 150°C, which could be separated as first and second IMC growth steps. Our results showed that the growth behavior of the first void matched the growth behavior of second Cu6Sn5, and that the growth behavior of the second void matched that of the second Cu3Sn. It could be confirmed that double-layer Kirkendall voids growth kinetics were closely related to the Cu–Sn IMC growth mechanism in the Cu/Sn/Cu microbump, which could seriously deteriorate the mechanical and electrical reliabilities of the fine-pitch microbump systems...

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Company Information:

Nepes Corporation

Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.

Seoul, South Korea

Component Packaging

  • Phone +82-2-3470-2700

Nepes Corporation website

Company Postings:

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