Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials

Published:

October 2, 2014

Author:

Jennifer Nguyen Ranilo Aranda, David Geiger, and Murad Kurwa

Abstract:

Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. As the results, there is a significant increase in the number of alternative low/no silver lead-free solder alloys available in the industry recently.

In this paper, we'll present the performance and process capability of various low/no silver alloy solder pastes. Data from printability, wetting test, slump test, solder ball test, voiding, etc… will be discussed and compared with the control SAC305 solder paste. Benefits and concerns of using low/no silver alloy solder paste materials will also be addressed....

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October 16, 2014

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Company Information:

Flex (Flextronics International)

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

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  • Phone 65 6890 7188
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