Numerical Study on New Pin Pull Test for Pad Cratering Of PCB

Published:

February 19, 2015

Author:

Billy Hu, Jesus Tan

Abstract:

Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance...

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Company Information:

Flex (Flextronics International)

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

Design, Service Provider

  • Phone 65 6890 7188
  • Fax 65 6543 1888

Flex (Flextronics International) website

Company Postings:

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