Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting

Published:

May 28, 2015

Author:

Brent Fischthal, Sr. Marketing Manager, Products & Solutions Michael Cieslinski, Engineering Manager Panasonic Factory Solutions Company of America.

Abstract:

The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization.

This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow....

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Company Information:

Panasonic Factory Solutions Company of America (PFSA)

PFSA develops and supports innovative manufacturing automation equipment, processes and solutions around the core of electronic assembly, microelectronic, software and circuit manufacturing

Rolling Meadows, Illinois, USA

Manufacturer of Assembly Equipment, OEM, Pick and Place

  • Phone 847-637-9600
  • Fax 847-637-9601

Panasonic Factory Solutions Company of America (PFSA) website

Company Postings:

(10) products in the catalog

(2) technical library articles

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