Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Published: |
November 5, 2015 |
Author: |
Rachel Miller Short, William E. Coleman Ph.D.; Photo Stencil | Joseph Perault; Parmi. |
Abstract: |
There has been recent activity and interest in Laser-Cut Electroform blank foils as an alternative to normal Electroform stencils. The present study will investigate and compare the print performance in terms of % paste transfer as well the dispersion in paste transfer volume for a variety of Electroform and Laser-Cut stencils with and without post processing treatments. Side wall quality will also be investigated in detail. A Jabil solder paste qualification test board will be used as the PCB test vehicle.... |
|
|
|
|
|
|
You must be a Company Information:
More articles from Photo Stencil LLC »
- Jan 11, 2013 - Electroformed vs. Laser-cut: A Stencil Performance Study
- Oct 25, 2012 - Stencil Printing of Small Apertures
- See all SMT / PCB technical articles from Photo Stencil LLC »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
Print Performance Studies Comparing Electroform and Laser-Cut Stencils article has been viewed 718 times
