• SMTnet
  • »
  • Technical Library
  • »
  • Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP

Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP

Published:

December 2, 2015

Author:

Myung-June Lee -Altera Corporation, SungSoon Park, DongSu Ryu, MinJae Lee - Amkor Technology, Hank Saiki, Seiji Mori, Makoto Nagai - NTK Technologies.

Abstract:

(Thermal Compression with Non-Conductive Paste Underfill) Method.

The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement.

Although the baseline packaging process methodology for a normal pad pitch (i.e. inline 50μm) within smaller chip size (i.e. 100 mm2) has been established and are in use for HVM production, there are several challenges to be addressed for further development for commercialization of finer bump pitch with larger die (i.e. ≤50μm tri-tier bond pad with the die larger than 400mm2).

This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish). Technical recommendations based on the lessons learned from a series of process experimentation will be provided, as well. Finally, this technology has been used for the successful launching of the company FPGA products with SFF packaging technology....

  • Download Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 

Company Information:

Semiconductor Company which design FBGA and its own PCB Board to test our chips.

Bayan Lepas, Penang, Malaysia

Manufacturer

  • Phone 604-6366479

See Company Website »

Company Postings:

(1) technical library article

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Sep 02, 2021 - UV Laser PCB Depaneling Machine Improve Cutting Effect | Winsmart Electronic Co.,Ltd
  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Browse Technical Library »

Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP article has been viewed 1242 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP
ICT Total SMT line Provider

SMT Feeders