PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
Published: |
December 23, 2015 |
Author: |
Edward Arthur, Charles Busa, Melissa Durfee, Chad Gibson, Wade Goldman P.E.; Raytheon Company, Space and Airborne Systems, The Charles Stark Draper Laboratory, Inc., Raytheon Company, Integrated Defense Systems. |
Abstract: |
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects, the causes of copper barrel cracks in printed circuit board (PCB) plated through holes is not well understood. Accordingly, there is a need to determine what affects the onset of barrel cracks and then control those causes to mitigate their initiation. The objective of this research is to conduct a design of experiment (DOE) to determine if there is a relationship between PCB fabrication processes and the prevalence of fine barrel cracks. The test vehicle used will be a 16-layer epoxy-based PCB that has two different sized plated through holes as well as buried vias.... |
|
|
|
|
|
|
You must be a Company Information:
- Oct 12, 2017 - Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow- Results of an Industry Round-Robin
- Nov 30, 2016 - Review of Interconnect Stress Testing Protocols and Their Effectiveness in Screening Microvias
- Jun 04, 2015 - Tin Whisker Risk Mitigation for High-Reliability Systems Integrators and Designers
- See all SMT / PCB technical articles from Raytheon »
More SMT / PCB assembly technical articles »
- Jan 17, 2023 - Introducing Closed-loop Nitrogen Control To Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - How Challenging Conventional Wisdom Can Optimize Solder Reflow | Heller Industries Inc.
- Jan 17, 2023 - The User Benefits of a Supplier Partnership | Heller Industries Inc.
- Jan 17, 2023 - Vacuum Fluxless Reflow Technology for Fine Pitch First Level Interconnect Bumping Applications | Heller Industries Inc.
- Jan 17, 2023 - Flux Management | Heller Industries Inc.
- Browse Technical Library »
PCB Fabrication Processes and Their Effects on Fine Copper Barrel Cracks article has been viewed 786 times
