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Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques

Published:

April 28, 2016

Author:

Julien Perraud, Arnaud Grivon.

Abstract:

Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic applications. Its usage is currently spreading across the industry fueled by the decreasing reliability margins induced by the miniaturization and interconnect pitch reduction. (...)

This paper will address the control of surface mount under filled assemblies, focusing on applicable inspection techniques and possible options to overcome their limitations....

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Company Information:

A French multinational company acting in areas such as defense, aerospace, airlines security and safety, information technology, and transportation.

Neuilly-sur-Seine, France

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  • Phone +33 1 57 77 80 00

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