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Characterization of Solder Defects on Package on Packages with AXI Systems for Inspection Quality Improvement

Published:

May 30, 2016

Author:

Zhen Feng, Ph. D., David Geiger, Weifeng Liu, Ph. D., Anwar Mohammed, Murad Kurwa, AEG, Flextronics, George Tint Ph. D., Saki America.

Abstract:

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls, we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. It is found that 3D measurements offer better defect inspection quality, lower false call and escapes....

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Company Information:

Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.

Singapore, Singapore

Consultant / Service Provider

  • Phone 65 6890 7188
  • Fax 65 6543 1888

See Company Website »

Company Postings:

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