PCB Laser Depanelizing Using a UV Laser
Published: |
October 6, 2016 |
Author: |
Bob Wettermann |
Abstract: |
One of the methods gaining in popularity for singulating rigid/flex, rigid and flex circuit boards post assembly is through the use of laser routing. This method has the advantage of speed, positional accuracy, no tooling wear and lastly no induced mechanical stresses on components during the singulating process.... |
|
|
|
|
|
|
You must be a More articles from BEST Inc. »
- May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials
- Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux
- Feb 01, 2017 - BGA Rework Process
- Aug 27, 2015 - Adhesive Backed Plastic Stencils vs Mini Metal Stencils
- Sep 11, 2014 - Plastic vs Metal Stencils for Prototype Printing
- See all SMT / PCB technical articles from BEST Inc. »
More SMT / PCB assembly technical articles »
- Feb 03, 2020 - Mechanical Drop Shock Testing | ACI Technologies, Inc.
- Jan 28, 2020 - Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum | Heller Industries Inc.
- Jan 13, 2020 - Atomic Layer Deposition | ACI Technologies, Inc.
- Jan 06, 2020 - Using mini PCB magazine loader to save more space for your SMT assembly line | ASCEN Technology
- Jan 02, 2020 - Counterfeit Component Analysis | ACI Technologies, Inc.
- Browse Technical Library »
PCB Laser Depanelizing Using a UV Laser article has been viewed 915 times
