PCB Laser Depanelizing Using a UV Laser
Published: |
October 6, 2016 |
Author: |
Bob Wettermann |
Abstract: |
One of the methods gaining in popularity for singulating rigid/flex, rigid and flex circuit boards post assembly is through the use of laser routing. This method has the advantage of speed, positional accuracy, no tooling wear and lastly no induced mechanical stresses on components during the singulating process.... |
|
|
|
|
|
|
You must be a More articles from BEST Inc. 
»
- May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials
- Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux
- Feb 01, 2017 - BGA Rework Process
- Aug 27, 2015 - Adhesive Backed Plastic Stencils vs Mini Metal Stencils
- Sep 11, 2014 - Plastic vs Metal Stencils for Prototype Printing
- See all SMT / PCB technical articles from BEST Inc. »
More SMT / PCB assembly technical articles »
- Jun 19, 2019 - Tin Whiskers: Risks with Lead Free | Part I | ACI Technologies, Inc.
- Jun 18, 2019 - Use of Pelseal® 2078 Viton® Caulk in Decapsulation of Electronics Components | ACI Technologies, Inc.
- Jun 17, 2019 - Fiducial Marks | ACI Technologies, Inc.
- Jun 12, 2019 - BGA Placement on Rework Station | ACI Technologies, Inc.
- Jun 11, 2019 - Reflow Experiment | ACI Technologies, Inc.
- Browse Technical Library »
PCB Laser Depanelizing Using a UV Laser article has been viewed 532 times
