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High Throw Electroless Copper - Enabling new Opportunities for IC Substrates and HDI Manufacturing

Published:

April 20, 2017

Author:

Tobias Sponholz, Lars-Eric Pribyl, Frank BrĂ¼ning, Robin Taylor

Abstract:

The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)

This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability....

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Company Information:

One of the world's leading suppliers of integrated production systems, chemistry, equipment, know-how and service for electroplating, semiconductor and printed circuit board manufacturing.

Berlin, Germany

Manufacturer

  • Phone (+49) 30-349 85-0
  • Fax (+49) 30-349 85-777

See Company Website »

Company Postings:

(2) products in the catalog

(12) technical library articles

(1) news release

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