NSOP Reduction for QFN RFIC Packages

Published:

August 31, 2017

Author:

Mumtaz Y. Bora

Abstract:

Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields.

Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction...

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Company Information:

A leading fabless provider of high-performance, radio frequency integrated circuits, or RFICs.

San Diego, California, USA

Manufacturer

  • Phone 858-731-9400
  • Fax 858-731-9499

See Company Website »

Company Postings:

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