• SMTnet
  • »
  • Technical Library
  • »
  • Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate

Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate

Published:

November 8, 2017

Author:

Viktoria Rawinski

Abstract:

Due to the ongoing trend towards miniaturization of power components, the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore, the role of void free solder joints in power electronics becomes more central. Voids developed during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, the company has developed a new technique to minimize the formation of these voids during the soldering process....

  • Download Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

kurtz ersa Corporation

Manufacturer of Selective Soldering Systems, Ersascope BGA Inspection Systems, BGA Rework Systems, Soldering Irons, Wave Solder and Reflow Equipment.

Wertheim, Germany

Manufacturer of Assembly Equipment, Selective Soldering, Soldering

  • Phone +49 (0) 93 42 / 80 00
  • Fax +49 (0) 93 42 / 80 01 00

kurtz ersa Corporation website

Company Postings:

(15) products in the catalog

(2) technical library articles

(244) news releases

  • Jul 19, 2019 - A Systematic Approach to RoHS Analysis | ACI Technologies, Inc.
  • Jul 11, 2019 - Design of Experimentation for Affordability | ACI Technologies, Inc.
  • Jul 10, 2019 - Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow | Heller Industries Inc.
  • Jul 05, 2019 - Fourier Transform Infrared Spectroscopy | ACI Technologies, Inc.
  • Jul 01, 2019 - Computer Aided Design, Manufacturing, and Engineering | ACI Technologies, Inc.
  • Browse Technical Library »

Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate article has been viewed 647 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate
Electronics Auditor Job

pcb components vacuum pick up