Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate
Published: |
November 8, 2017 |
Author: |
Viktoria Rawinski |
Abstract: |
Due to the ongoing trend towards miniaturization of power components, the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore, the role of void free solder joints in power electronics becomes more central. Voids developed during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, the company has developed a new technique to minimize the formation of these voids during the soldering process.... |
You must be a registered user to talk back to us. |
Company Information:
More articles from kurtz ersa Corporation »
- May 22, 2019 - BTC and SMT Rework Challenges
- See all SMT / PCB technical articles from kurtz ersa Corporation »
More SMT / PCB assembly technical articles »
- Mar 19, 2024 - What is Underfill | GPD Global
- Mar 19, 2024 - Made in Japan: Solder Paste Jet Dispensing Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 26, 2024 - Precision Control in Electronic Assembly: Selective Wave Soldering Machine | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Feb 02, 2024 - Maximizing Efficiency: The High-Speed SMT Line With Laser Depanelizer | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Dec 27, 2023 - Revolutionizing Tech: SMT Auto IC Programming Machine Mastery | I.C.T ( Dongguan ICT Technology Co., Ltd. )
- Browse Technical Library »
Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate article has been viewed 1356 times