Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate
Published: |
November 8, 2017 |
Author: |
Viktoria Rawinski |
Abstract: |
Due to the ongoing trend towards miniaturization of power components, the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore, the role of void free solder joints in power electronics becomes more central. Voids developed during soldering reduce the actual thermal transfer and can cause thermal damage of the power components up to their failure. For this reason, the company has developed a new technique to minimize the formation of these voids during the soldering process.... |
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