Unlocking The Mystery of Aperture Architecture for Fine Line Printing

Published:

June 13, 2018

Author:

Clive Ashmore

Abstract:

The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.

The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices....

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June 26, 2018

The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process. The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices....

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Company Information:

ASM Assembly Systems GmbH & Co. KG

ASM Assembly Systems is the supplier of SIPLACE, a leader in surface mount technology (SMT) equipment, software, and services to the electronics assembly market.

Munich, Germany

Manufacturer of Assembly Equipment, Pick and Place, Software Manufacturer

  • Phone +49 - 89 - 208 00 - 278 19
  • Fax +49 - 89 - 208 00 - 366 92

ASM Assembly Systems GmbH & Co. KG website

Company Postings:

(5) products in the catalog

(2) technical library articles

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