Moisture and Bubble-Free Material Preparation in Larger Quantities

Published:

September 10, 2018

Author:

Scheugenpflug

Abstract:

Issue: Moisture and bubbles in your dispensing material with larger quantities Solution: Scheugenpflug’s 55-gal Barrel Agitator Station Barrel agitators for casting resins take their technology from the paint sector. They fall short of meeting the special demands of the auto, medical, aeronautics and electronics industries. They can’t guarantee a solid seal on the barrels – often containing expensive, moisture sensitive resins – allowing the humidity of the surrounding environment to damage the material. Also, conventional barrel agitators, as opposed to smaller units, cannot work in a vacuum to process materials directly....

  • Download Moisture and Bubble-Free Material Preparation in Larger Quantities article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Scheugenpflug Inc.

Specializes in automated metering & dispensing solutions, supplier of resin metering systems, global expert in production and process automation, vacuum dispensing production systems, and systems for dispensing of abrasive media.

Kennesaw, Georgia, USA

Adhesives/Dispensing, Assembly, Manufacturer of Assembly Equipment

  • Phone 7702180835
  • Fax 7702180931

Scheugenpflug Inc. website

Company Postings:

(4) products in the catalog

(2) upcoming training courses

(1) upcoming event

(5) technical library articles

(5) news releases

  • Apr 27, 2018 - Understanding the Heat Output of your BGA Rework Station | Precision PCB Services, Inc
  • Apr 27, 2018 - Hot Air vs. IR BGA Rework Stations | Precision PCB Services, Inc
  • Feb 22, 2018 - Hand Soldering with Lead Free Alloys | Metcal
  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Nov 08, 2017 - Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate | kurtz ersa Corporation
  • Browse Technical Library »

Moisture and Bubble-Free Material Preparation in Larger Quantities article has been viewed 163 times

pcb components vacuum pick up

Dual Mode 3D AOI/SPI