Fill the Void II: An Investigation into Methods of Reducing Voiding
Published: |
October 3, 2018 |
Author: |
Tony Lentz - FCT Assembly, Patty Chonis, JB Byers - A-Tek Systems |
Abstract: |
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.... |
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