Fill the Void II: An Investigation into Methods of Reducing Voiding
Published: |
October 3, 2018 |
Author: |
Tony Lentz - FCT Assembly, Patty Chonis, JB Byers - A-Tek Systems |
Abstract: |
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.... |
|
|
|
|
|
|
You must be a More articles from FCT ASSEMBLY, INC. »
- Feb 12, 2020 - Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
- Oct 10, 2019 - Fill the Void IV: Elimination of Inter-Via Voiding
- Mar 13, 2019 - An Investigation Into The Durability Of Stencil Coating Technologies
- Jul 18, 2018 - Improve SMT Assembly Yields Using Root Cause Analysis in Stencil Design
- Oct 26, 2017 - Can Nano-Coatings Really Improve Stencil Performance?
- See all SMT / PCB technical articles from FCT ASSEMBLY, INC. »
More SMT / PCB assembly technical articles »
- Mar 24, 2020 - DA-1200 THT automated inspection system service report | 1 CLICK SMT TECHNOLOGY CO., Limited
- Mar 12, 2020 - IPC Apex Expo 2020 Remarks | SMTnet
- Mar 09, 2020 - Cleaning No-Clean Fluxes Prior to Conformal Coating | ACI Technologies, Inc.
- Mar 01, 2020 - Through-Hole Soldering Defects And The Solutions | 1 CLICK SMT TECHNOLOGY CO., Limited
- Feb 26, 2020 - Dispensing EMI Shielding Materials: An Alternative to Sputtering | Nordson ASYMTEK
- Browse Technical Library »
Fill the Void II: An Investigation into Methods of Reducing Voiding article has been viewed 717 times
