Status and Outlooks of Flip Chip Technology

Published:

November 14, 2018

Author:

John H. Lau

Abstract:

Status of flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. Finally, the competition on flip chip technology will be briefly mentioned....

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Company Information:

ASM Pacific Technology

ASMPT is a world leader in the supply of semiconductor assembly and packaging equipment and materials as well as surface mount technology solutions.

Kwai Chung, Hong Kong

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  • Phone +852 2619 2803

ASM Pacific Technology website

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