Process Optimization for Fine Feature Solder Paste Dispensing

Published:

December 19, 2018

Author:

Maria Durham, Greg Wade, and Brandon Judd; Indium Corporation, John Boggiatto; ITW EAE - Speedline Technologies

Abstract:

With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology, it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages, as well as dispensing ultra-fine lines in MEMs lid-attach applications. In order to achieve ultra-fine dots and fine line widths while dispensing solder paste, both the solder material and dispensing equipment need to be optimized. Optimizing the equipment can be very challenging, as there are many input variables that can affect the dispense quality of the solder paste. In this paper we will evaluate the many equipment variables involved in the solder paste dispensing process, and the impact these variables have on the dispense quality of the solder paste....

  • Download Process Optimization for Fine Feature Solder Paste Dispensing article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(10) products in the catalog

(27) technical library articles

(357) news releases

  • Apr 19, 2022 - Scalable Reliability for Consumer Electronics | HZO, Inc.
  • Apr 19, 2022 - Protective Coatings for Non-Invasive Medical Devices for Real-World Reliability | HZO, Inc.
  • Apr 19, 2022 - How to Resolve Smart Meter Reliability Issues with Parylene Conformal Coating | HZO, Inc.
  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Browse Technical Library »

Process Optimization for Fine Feature Solder Paste Dispensing article has been viewed 957 times

Sell Your Used SMT & Test Equipment

Inline Cleaning Machine Hydro-clean Array