Risk Mitigation in Hand Soldering

Published:

January 2, 2019

Author:

Robert Roush

Abstract:

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them....

  • Download Risk Mitigation in Hand Soldering article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Metcal

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Manufacturer

  • Phone 1-714-799-9910
  • Fax 1-714-828-2001

Metcal website

Company Postings:

(21) products in the catalog

(10) technical library articles

(145) news releases

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Browse Technical Library »

Risk Mitigation in Hand Soldering article has been viewed 1301 times

Comprehensive Analytical Services and Support

Facility Closure