Risk Mitigation in Hand Soldering

Published:

January 2, 2019

Author:

Robert Roush

Abstract:

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them....

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Company Information:

Metcal

Manufacturer of high-performance precision rework systems for the electronics bench. Product lines include: Hand Soldering and Desoldering, Convection Rework products, Fume Extraction and Fluid Dispensing tools.

Cypress, California, USA

Adhesives/Dispensing, Manufacturer of Assembly Equipment, Repair/Rework, Soldering

  • Phone 1-714-799-9910
  • Fax 1-714-828-2001

Metcal website

Company Postings:

(20) products in the catalog

(10) technical library articles

(129) news releases

  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
  • Jul 27, 2017 - Electrochemical Methods to Measure the Corrosion Potential of Flux Residues | KYZEN Corporation
  • Jul 21, 2017 - How to calibrate JUKI CF feeder | ZK Electronic Technology Co., Limited
  • Mar 30, 2017 - Solder Paste for BGA Rework | Multiple Methods for Applying Paste Flux | BEST Inc.
  • Feb 01, 2017 - BGA Rework Process | BEST Inc.
  • Browse Technical Library »

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