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Evaluation, Selection and Qualification of Replacement Reworkable Underfill Materials

Published:

February 27, 2019

Author:

Jeffrey Colish, Luis Lopez, Carlo Viola

Abstract:

A study was performed to investigate, evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs), Leadless SMT devices, QFNs, connectors and passive devices to improve reliability. The supplier of the sole source, currently used underfill, has indicated they may discontinue its manufacture in the near future. The current underfill material is used on numerous circuit card assemblies (CCAs) at several sites and across multiple programs/business areas. In addition, it is used by several of our contract CCA suppliers.

The study objectives include evaluation of material properties for down select, dispensability and rework evaluation for further down select, accelerated life testing for final selection and qualification; and process development to implement into production and at our CCA suppliers. The paper will describe the approach used, material property test results and general findings relative to process characteristics and rework ability....

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Company Information:

Northrop Grumman Corporation

Northrop Grumman is a global aerospace and defense technology company providing innovative systems, products and solutions to government and commercial customers.

Blacksburg, Virginia, USA

Other

  • Phone 540-552-3011
  • Fax 540-953-1841

Northrop Grumman Corporation website

Company Postings:

(2) technical library articles

  • Jan 02, 2019 - Risk Mitigation in Hand Soldering | Metcal
  • Apr 27, 2018 - Understanding the Heat Output of your BGA Rework Station | Precision PCB Services, Inc
  • Apr 27, 2018 - Hot Air vs. IR BGA Rework Stations | Precision PCB Services, Inc
  • Feb 22, 2018 - Hand Soldering with Lead Free Alloys | Metcal
  • Dec 07, 2017 - Utility of Dual Applicators for Non-Atomized Conformal Coating to Improve High-Volume Manufacturing Optimization | Nordson ASYMTEK
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