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Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints

Published:

March 6, 2019

Author:

Maxim Serebreni, Dr. Nathan Blattau, Dr. Gilad Sharon, Dr. Craig Hillman

Abstract:

Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However, variability in the mechanical properties such as the coefficient of thermal expansion and elastic modulus effects the material selection process by introducing uncertainty to the long term impacts on the reliability of the electronics. Typically, the main reliability issue is solder joint fatigue which accounts for a large amount of failures in electronic components. Therefore, it is necessary to understand the effect of polymer encapsulations (coatings, pottings and underfills) on the solder joints when predicting reliability.

This paper presents the construction and validation of a thermo-mechanical tensile fatigue specimen. The thermal cycling range was matched with potting expansion properties in order to vary the magnitude of tensile stress imposed on solder joints...

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Company Information:

DfR Solutions

DfR Solutions has world-renowned expertise in applying the science of Reliability Physics to electrical and electronics technologies, and is a leading provider of quality, reliability, and durability (QRD) research and consulting for the electronics industry.

College Park, Maryland, USA

Service Provider

  • Phone 301 474-0607
  • Fax 240 757-0083

DfR Solutions website

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