Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Published:

April 17, 2019

Author:

Reza Ghaffarian, Ph.D.

Abstract:

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging....

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Jet Propulsion Laboratory

The JPL is the lead U.S. center for robotic exploration of the solar system, and conducts major programs in space-based Earth sciences and astronomy.

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