Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle

Published:

May 15, 2019

Author:

Steven Perng, Weidong Xie

Abstract:

As the demand for higher routing density and transfer speed increases, Via-In-Pad Plated Over (VIPPO) has become more common on high-end telecommunications products. The interactions of VIPPO with other features used on a PCB such as the traditional dog-bone pad design could induce solder joints to separate during the second and thereafter reflows. The failure has been successfully reproduced, and the typical failure signature of a joint separation has been summarized.

To better understand the solder separation mechanism, this study focuses on designing a test vehicle to address the following three perspectives: PCB material properties, specifically the Z-direction or out-of-plane Coefficient of Thermal Expansion (CTE); PCB thickness and back drill depth; and quantification of the driving force magnitude beyond which the separation is due to occur....

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Company Information:

Cisco Systems, Inc.

Cisco designs, manufactures, and sells Internet protocol (IP)-based networking and other products related to the communications and IT industry and provide services associated with these products.

San Jose, CA, USA

Manufacturer's Rep

  • Phone 4085264000

Cisco Systems, Inc. website

Company Postings:

(4) technical library articles

(3) news releases

  • Jun 17, 2019 - Fiducial Marks | ACI Technologies, Inc.
  • Jun 12, 2019 - BGA Placement on Rework Station | ACI Technologies, Inc.
  • Jun 11, 2019 - Reflow Experiment | ACI Technologies, Inc.
  • Jun 11, 2019 - Component Failure Analysis - Hermetic Packaging | ACI Technologies, Inc.
  • Jun 07, 2019 - Surface Finish Issues Affecting Solderability and Reliability | ACI Technologies, Inc.
  • Browse Technical Library »

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