Die Attach Dispensing Methods

Published:

May 21, 2019

Author:

ACI Technologies, Inc.

Abstract:

Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives. ...

  • Download Die Attach Dispensing Methods article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant, Design, IPC Standards Certification Center, Service Provider, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

ACI Technologies, Inc. website

Company Postings:

(24) products in the catalog

(17) upcoming training courses

(63) technical library articles

(3) news releases

  • Nov 04, 2020 - WHY CLEAN A NO-CLEAN FLUX | KYZEN Corporation
  • Nov 04, 2020 - Higher Defluxing Temperature and Low Standoff Component Cleaning - A Connection? | ZESTRON Americas
  • Apr 14, 2020 - Reliable Selective Soldering For High Volume Assemblies | ITW EAE
  • Apr 14, 2020 - Stencil Printing 008004/0201 Aperture Components | ITW EAE
  • Apr 14, 2020 - Selective Solder Fine Pitch Components On High Thermal Mass Assembly | ITW EAE
  • Browse Technical Library »

Die Attach Dispensing Methods article has been viewed 247 times

SMT Reflow Soldering Equipment Company of the Year 2020!

On-board Dispensing of Dots & Lines