Thermal Profiling for Reflow
Published: |
May 21, 2019 |
Author: |
ACI Technologies, Inc. |
Abstract: |
Reflow temperature profiling is the most important aspect of proper control of the solder reflow process. It may appear to some to be a magical art practiced by a select experienced few, who are able to divine the proper settings for a reflow oven by reading graphs as if they were tea leaves. This does not have to be true. This article outlines a systematic method by which engineers and technicians can implement a successful reflow process from scratch.... |
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