Preparation for Reflow Profiling

Published:

May 24, 2019

Author:

ACI Technologies, Inc.

Abstract:

There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points....

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Company Information:

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant / Service Provider, Standards Setting / Certification, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

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Company Postings:

(24) products in the catalog

(1) upcoming training course

(64) technical library articles

(2) news releases

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