Preparation for Reflow Profiling

Published:

May 24, 2019

Author:

ACI Technologies, Inc.

Abstract:

There is a smaller process window and a much narrower margin of error when creating and using lead-free reflow profiles for surface mount parts on printed circuit boards (PCBs). Solder balls, dewetting, tombstones, voids, and head-on-pillow problems will occur much more frequently because lead-free alloys behave differently than eutectic pastes. Problems are compounded due to the extra heat necessary for some lead-free pastes to reach their melting points....

  • Download Preparation for Reflow Profiling article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant, Design, IPC Standards Certification Center, Service Provider, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

ACI Technologies, Inc. website

Company Postings:

(24) products in the catalog

(67) upcoming training courses

(32) technical library articles

(1) news release

  • Jun 03, 2019 - SMT Under Stencil Wiper Rolls | Swiftmode Malaysia (Penang) Sdn Bhd
  • May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials | BEST Inc.
  • Jan 02, 2019 - Risk Mitigation in Hand Soldering | Metcal
  • Apr 27, 2018 - Understanding the Heat Output of your BGA Rework Station | Precision PCB Services, Inc
  • Apr 27, 2018 - Hot Air vs. IR BGA Rework Stations | Precision PCB Services, Inc
  • Browse Technical Library »

Preparation for Reflow Profiling article has been viewed 79 times

3D solder paste inspection system

flying probe test services