Component Failure Analysis - Hermetic Packaging

Published:

June 11, 2019

Author:

ACI Technologies, Inc.

Abstract:

Recently ACI Technologies was asked to perform failure analysis on a hermetically sealed transistor for potential electrostatic discharge (ESD) or electrostatic overstress (EOS). ACI was asked to determine if the field-failed transistor was damaged by ESD or EOS. In order to properly assess the failure, additional samples were requested....

  • Download Component Failure Analysis - Hermetic Packaging article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

ACI Technologies, Inc.

ACI, an authorized IPC Training Center operating the National Electronics Manufacturing Center of Excellence providing analytical testing, manufacturing and repair services to the electronics industry.

Philadelphia, Pennsylvania, USA

Consultant, Design, IPC Standards Certification Center, Service Provider, Training Provider

  • Phone 610 362 1200
  • Fax 610 362 1290

ACI Technologies, Inc. website

Company Postings:

(24) products in the catalog

(58) upcoming training courses

(38) technical library articles

(1) news release

  • Jul 10, 2019 - Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow | Heller Industries Inc.
  • Jun 03, 2019 - SMT Under Stencil Wiper Rolls | Swiftmode Malaysia (Penang) Sdn Bhd
  • May 29, 2019 - Hand Printing using Nanocoated and other High End Stencil Materials | BEST Inc.
  • Jan 02, 2019 - Risk Mitigation in Hand Soldering | Metcal
  • Apr 27, 2018 - Understanding the Heat Output of your BGA Rework Station | Precision PCB Services, Inc
  • Browse Technical Library »

Component Failure Analysis - Hermetic Packaging article has been viewed 99 times

Led testing color sensors

SMT Spare Parts and Feeders