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Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper

Published:

June 26, 2019

Author:

Saminda Dharmarathna, Christian Rietmann, William Bowerman, Kesheng Feng, Jim Watkowski

Abstract:

Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating....

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Company Information:

MacDermid Inc.

MacDermid is a global provider of specialty chemicals for the most complex printed circuit board designs. We specialize in the areas of final finishes, through-hole metallization, and circuit formation.

Waterbury, Connecticut, USA

Antistatic, Manufacturer of Assembly Material

  • Phone 203-575-5700

MacDermid Inc. website

Company Postings:

(6) technical library articles

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  • Oct 07, 2019 - Power Interfaces | ACI Technologies, Inc.
  • Sep 27, 2019 - Cleanliness/Corrosion Mitigation | ACI Technologies, Inc.
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