Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow
Published: |
July 10, 2019 |
Author: |
M. Barnes, D.W. Lee, D. Heller - Heller Industries, M.Holtzer, T. Cucu - Alpha Assembly Solutions, J. Fudala, J. Renda - MacDermid Enthone Electronic Solutions |
Abstract: |
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.... |
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