Via Fill and Through Hole Plating Process with Enhanced TH Microdistribution

Published:

July 17, 2019

Author:

Maria Nikolova, Confesol Rodriguez, Kesheng Feng, Carmichael Gugliotti, William Bowerman, Jim Watkowski, Bob Wei

Abstract:

The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface.

In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented....

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Company Information:

MacDermid Inc.

MacDermid is a global provider of specialty chemicals for the most complex printed circuit board designs. We specialize in the areas of final finishes, through-hole metallization, and circuit formation.

Waterbury, Connecticut, USA

Antistatic, Manufacturer of Assembly Material

  • Phone 203-575-5700

MacDermid Inc. website

Company Postings:

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