Common Process Defect Identification of QFN Packages

Published:

July 23, 2019

Author:

David Bernard @ Dage Precision Industries, Bob Willis @ ASKbobwillis.com

Abstract:

The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed....

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Company Information:

Nordson DAGE

The leading provider of award winning bond testing equipment and continues to invest significantly in research and development to remain at the cutting edge of bond tester technology.

Aylesbury. Buckinghamshire, United Kingdom

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  • Phone +44 (0) 1296 317800
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