• SMTnet
  • »
  • Technical Library
  • »
  • Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies

Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies

Published:

July 24, 2019

Author:

Brook Sandy-Smith

Abstract:

Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder paste, there is a high propensity for voiding due to the confined nature of the solder paste deposits under the component. Once reflowed, many factors contribute to the amount of voiding in a solder joint such as the reflow profile, designs of the component, board and stencil, and material factors. This study will focus on the solder paste alloy and flux combination as well as profile and board surface finishes....

  • Download Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Indium Corporation

Solder pastes, solder preforms, solder spheres, soldering fluxes, electrically-conductive adhesives. All alloys: tin-lead, lead-free, indium alloys, and more.

Utica, New York, USA

Manufacturer of Assembly Material, Soldering

  • Phone 315-853-4900
  • Fax 315-853-1000

Indium Corporation website

Company Postings:

(9) products in the catalog

(25) technical library articles

(278) news releases

  • Aug 19, 2019 - Automated Testing with Boundary Scan | ACI Technologies, Inc.
  • Aug 14, 2019 - Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance | KYZEN Corporation
  • Aug 08, 2019 - Selective Soldering and the Modular Approach | ACI Technologies, Inc.
  • Aug 01, 2019 - Attaching Fiber Optic Modules | ACI Technologies, Inc.
  • Jul 29, 2019 - Conformal Coating Processes | ACI Technologies, Inc.
  • Browse Technical Library »

Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies article has been viewed 141 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Voiding Performance with Solder Pastes Containing Modified SAC Alloys for Automotive Applications in Bottom Terminated Component Assemblies
Reflow Oven

TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit