Design Parameters Influening Reliability of CCGA Assembly; a Sensitivity Analysis

Published:

July 30, 2019

Author:

Amaneh Tasooji, Antonio Rinaldi - Arizona State University, Reza Ghaffarian - Jet Propulsion Laboratory

Abstract:

Area Array microelectronic packages with small pitch and large I/O counts are now widely used in microelectronics packaging. The impact of various package design and materials/process parameters on reliability has been studied through extensive literature review. Reliability of Ceramic Column Grid Array (CCGA) package assemblies has been evaluated using JPL thermal cycle test results (-50°/75°C, -55°/100°C, and -55°/125°C), as well as those reported by other investigators. A sensitivity analysis has been performed using the literature data to study the impact of design parameters and global/local stress conditions on assembly reliability. The applicability of various life-prediction models for CCGA design has been investigated by comparing model's predictions with the experimental thermal cycling data. Finite Element Method (FEM) analysis has been conducted to assess the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and locations observed in JPL test assemblies....

  • Download Design Parameters Influening Reliability of CCGA Assembly; a Sensitivity Analysis article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Jet Propulsion Laboratory

The JPL is the lead U.S. center for robotic exploration of the solar system, and conducts major programs in space-based Earth sciences and astronomy.

Pasadena, California, USA

Standards Setting / Certification, Training Provider

  • Phone +1-818-354-4321

Jet Propulsion Laboratory website

Company Postings:

(6) technical library articles

  • Jun 27, 2022 - INTELLI-Pro -- The Future of Automated Optical Inspection | MIRTEC Corp
  • Apr 11, 2022 - iNEMI Webinar 07.07.2021 - PCB Cleaning | ZESTRON Americas
  • Jan 28, 2022 - Open Radio Unit White Box 5G | Whizz Systems
  • Nov 10, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Oct 20, 2021 - PCB Surface Finishes & The Cleaning Process - A Compatibility Study | ZESTRON Americas
  • Browse Technical Library »

Design Parameters Influening Reliability of CCGA Assembly; a Sensitivity Analysis article has been viewed 509 times

Manufacturing Software

Jetting Pump for Integration