Cracks: The Hidden Defect

Published:

August 15, 2019

Author:

John Maxwell

Abstract:

Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock has become a "pat" answer for all of these cracks, but about 75 to 80% originate from other sources. These sources include pick and place machine centering jaws, vacuum pick up bit, board depanelization, unwarping boards after soldering, test fixtures, connector insulation, final assembly, as well as defective components. Each source has a unique signature in the type of crack that it develops so that each can be identified as the source of error....

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Company Information:

AVX Corporation

A leading international electronic supplier of components and connectors with worldwide manufacturing facilities, offering the world's broadest selection of passive electronic components.

Fountain Inn, South Carolina, USA

  • Phone (1) 864-967-2150

AVX Corporation website

Company Postings:

(2) technical library articles

(2) news releases

  • Sep 16, 2019 - Virtual Manufacturing | ACI Technologies, Inc.
  • Sep 03, 2019 - Microscopy in Failure Analysis | ACI Technologies, Inc.
  • Aug 19, 2019 - Automated Testing with Boundary Scan | ACI Technologies, Inc.
  • Aug 14, 2019 - Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance | KYZEN Corporation
  • Aug 08, 2019 - Selective Soldering and the Modular Approach | ACI Technologies, Inc.
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