Fill the Void IV: Elimination of Inter-Via Voiding

Published:

October 10, 2019

Author:

Tony Lentz - FCT Assembly, Greg Smith - BlueRing Stencils

Abstract:

Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs.

Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted.

In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."...

  • Download Fill the Void IV: Elimination of Inter-Via Voiding article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

FCT ASSEMBLY, INC.

With numerous facilities in the United States, we are one of the electronics industry's leading manufacturers of lead-free solder products, superior quality stencils, and precision cut parts.

Greeley, Colorado, USA

Manufacturer of Assembly Material, Soldering

  • Phone 970-346-8002
  • Fax 970-346-8331

FCT ASSEMBLY, INC. website

Company Postings:

(14) products in the catalog

(11) technical library articles

(176) news releases

  • Mar 24, 2020 - DA-1200 THT automated inspection system service report | 1 CLICK SMT TECHNOLOGY CO., Limited
  • Mar 12, 2020 - IPC Apex Expo 2020 Remarks | SMTnet
  • Mar 09, 2020 - Cleaning No-Clean Fluxes Prior to Conformal Coating | ACI Technologies, Inc.
  • Mar 01, 2020 - Through-Hole Soldering Defects And The Solutions | 1 CLICK SMT TECHNOLOGY CO., Limited
  • Feb 26, 2020 - Dispensing EMI Shielding Materials: An Alternative to Sputtering | Nordson ASYMTEK
  • Browse Technical Library »

Fill the Void IV: Elimination of Inter-Via Voiding article has been viewed 601 times

Software for SMT

fluid dispensing robots - techcon