A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism

Published:

December 26, 2019

Author:

Yaqiu Li, Weiwei Hu, Yufeng Sun, Zili Wang, Ali Mosleh

Abstract:

Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.

In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB....

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Company Information:

Beihang University

Beihang University, previously known as Beijing University of Aeronautics and Astronautics is a major public research university located in Beijing, China, emphasizing engineering, technology, and the hard sciences.

Beijing, China

School

  • Phone 86-10-8231-5729

Beihang University website

Company Postings:

(1) technical library article

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