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Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Published:

January 9, 2020

Author:

Philipp Nothdurft, Gisbert Riess, Wolfgang Kern

Abstract:

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing....

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Company Information:

Polymer Competence Center Leoben GmbH

PCCL is the leading Austrian "Center of Excellence" for cooperative research in the area of polymer engineering and sciences.

Leoben, Austria

Research Institute/Laboratory

  • Phone +43 3842 429620

Polymer Competence Center Leoben GmbH website

Company Postings:

(1) technical library article

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