• SMTnet
  • »
  • Technical Library
  • »
  • Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Published:

January 9, 2020

Author:

Philipp Nothdurft, Gisbert Riess, Wolfgang Kern

Abstract:

PCBs have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing....

  • Download Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms article
  • To read this article you need to have Adobe PDF installed

You must be a registered user to talk back to us.

 
Company Information:

Polymer Competence Center Leoben GmbH

PCCL is the leading Austrian "Center of Excellence" for cooperative research in the area of polymer engineering and sciences.

Leoben, Austria

Research Institute / Laboratory

  • Phone +43 3842 429620

Polymer Competence Center Leoben GmbH website

Company Postings:

(1) technical library article

  • Jun 28, 2021 - Understanding the Cleaning Process for Automatic Stencil Printers | ITW EAE
  • Jun 15, 2021 - Dispensing EMI Shielding Materials: An Alternative to Sputtering | Nordson ASYMTEK
  • Feb 20, 2021 - Humitector™ Type 2 Non-Reversible Humidity Indicator Cards from Clariant help assure the integrity of moisture-sensitive surface-mount devices | Clariant Cargo & Device Protection
  • Jan 03, 2021 - Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies | SMTnet
  • Dec 07, 2020 - A Non-destructive Approach to Identify Intermittent Failure Locations on Printed Circuit Cards (PCC) that have been Temperature Cycle Tested | ACI Technologies, Inc.
  • Browse Technical Library »

Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms article has been viewed 612 times

  • SMTnet
  • »
  • Technical Library
  • »
  • Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
Reflow Oven

best reflow oven