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Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum

Published:

January 28, 2020

Author:

Heller Industries

Abstract:

This paper explores new advances in the reflow soldering process including vacuum technology and warpage mitigation systems. The first topic for discussion will be the implementation of a vacuum process directly in a conventional inline soldering system. The second topic presented is the mitigation of warpage on substrates or wafers....

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Company Information:

Heller Industries Inc.

Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.

Florham Park, New Jersey, USA

Manufacturer of Assembly Equipment, OEM, Soldering

  • Phone 973-377-6800
  • Fax 973-377-3862

Heller Industries Inc. website

Company Postings:

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(2) technical library articles

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Jetting Pump for Integration

Voidless Reflow Soldering