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A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS

Published:

July 2, 2020

Author:

Ranjit Pandher, Rahul Raut, Michael Liberatore, Navendra Jodhan, and Karen Tellefsen

Abstract:

Head-in-Pillow (HIP) defects are a growing concern in the electronics industry. These defects are usually believed to be the result of several factors, individually or in combination. Some of the major contributing factors include: surface quality of the BGA spheres, activity of the paste flux, improper placement / misalignment of the components, a non-optimal reflow profile, and warpage of the components. To understand the role of each of these factors in producing head-in-pillow defects and to find ways to mitigate them, we have developed two in-house tests....

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July 3, 2020

There seems to be a problem with the link to the paper A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS error 404

July 6, 2020

Thanks, Bob. We got caught with a file name that was just a bit too long. Mark this one fixed.

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Company Information:

Cookson Electronics

Leading materials science company that provides high performance materials, chemistry and technology solutions to the electronics and surface finishing industries worldwide.

Lakeville, Minnesota, USA

Manufacturer of Assembly Material

  • Phone 508-520-0083

Cookson Electronics website

Company Postings:

(4) products in the catalog

(10) technical library articles

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