Via In Pad - Conductive Fill or Non-Conductive Fill?

Published:

July 15, 2020

Author:

Tech Talk for Techies

Abstract:

In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment....

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Company Information:

Advanced Circuits

One-Stop Solution for PCB & Prototype Assembly Expanded PCB manufacturing capabilities to support advanced designs with demanding requirements including laser-drilled microvias, cavity boards, heavy copper up to 20 oz., via-in-pad

Aurora, Colorado, USA

Manufacturer of Bare PCBs

  • Phone 800-289-1724

Advanced Circuits website

Company Postings:

(1) technical library article

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